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High Frequency PCB

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High Frequency PCB Manufacturer


Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm 

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.

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High Frequency PCB (HF PCB) manufacturers have a range of core competencies and expertise to ensure the manufacture of high quality, high performance HF PCBs. Below are some of the key capabilities that a High Frequency PCB manufacturer should have:

Material Selection and Sourcing Capabilities:

Manufacturers should be familiar with the characteristics of various HF materials (e.g. Rogers 4350B, Taconic RF-35, etc.) and be able to select the most suitable materials based on customer needs and application scenarios.

Establish long-term relationships with reliable suppliers to ensure access to high-quality raw materials.

Design and R&D Capabilities:

With a professional circuit design team, we are able to provide customized high-frequency circuit design solutions for customers.

Ability to optimize complex circuit layouts to reduce signal loss and improve electrical performance.

Precision Processing Capability:

Adopting advanced CNC machine tools and laser processing equipment to realize high-precision drilling, cutting and molding processes.

Ensure that the dimensional accuracy, tolerance control and surface flatness of the circuit boards meet the requirements of high-frequency applications.

High-precision Printing Capability:

Uses high-precision screen printing technology to ensure accuracy and consistency of conductive patterns.

Capable of handling fine line widths and spacing to meet the requirements of high frequency signal transmission.

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Soldering and Assembly Capability:

Proficient in welding techniques for high frequency components to ensure welding quality and reliability of electrical connections.

Ability to assemble complex circuit boards, including multilayer boards and embedded components.

Testing and Verification Capability:

Equipped with professional test equipment, capable of conducting electrical performance tests, impedance matching verification, etc. on high-frequency circuit boards.

Able to provide detailed test reports to ensure that the boards meet customer performance requirements.

Quality Control and Reliability Guarantee:

Implementation of strict quality management system, quality control from raw material procurement to finished product shipment of each link.

Reliability testing and certification to ensure that high-frequency circuit boards can still work stably in harsh environments.

Customized Service Capability:

Provide customized high-frequency PCB solutions according to customers' special needs, including special materials and special processes.

Provide technical support and after-sales service to solve the problems encountered by customers in the process of use.

Therefore, HF PCB manufacturers should have the ability of material selection, design and development, precision machining, high-precision printing, welding and assembly, testing and verification, quality control and customized services. The combined use of these capabilities will ensure the manufacture of high-quality, high-performance high-frequency circuit boards that meet customer needs and application scenarios.

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