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Rogers PCB

Rogers High Frequency Board


Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Surface Technology : Gold deposition, Gold plating, Tin spraying, OSP ;

Processing Size : 600 * 1200mm ;

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers.

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.

INQUIRY

Shenzhen Xinchenger Electronics Co., Ltd. is a one-stop solution strength factory for high-reliability PCBs and PCBAs, with rich experience from single-sided to complex multi-layer printed circuit boards and top-level assemblies (PCBA).

We have a wide range of domestic and imported HF plates: Rogers, Taconic, Isola, F4B (Teflon), TP-2, FR4, etc. with dielectric constants ranging from 2.2-10.6. We can provide 24 hours fast sample service in time to win business opportunities for our customers. Meanwhile, our company has more than ten years of strong production experience, skillful craftsmanship, engineering technology and excellent service. We have the advantages of high quality, low cost and foreign information technology support.Long-term supply of high frequency PCB circuit boards, Rogers PCB high frequency, Taconic PCB high frequency, F4B/Teflon PCB high frequency, microwave RF boards, special circuit boards and so on. HF circuit boards, PCB high frequency boards, Suitable for data communication high frequency PCB.

The RT/Duroid 5880 Rogers high frequency PCB is made of polytetrafluoroethylene glass fiber reinforced material. High frequency circuit design has always had strict requirements for the dielectric constant of printed circuit board. The dielectric constant of RT/duroid5880 measured at a working frequency of 10GHz is only 2.2, which is significantly lower than that of similar materials in the current market. Therefore, from the perspective of performance parameters and production costs, this board is more suitable for high-frequency design applications compared to similar products. At the same time, the dielectric loss of the board is measured under the same standard, only 0.0009. The extremely low dielectric loss makes it very suitable for high-frequency and broadband design applications that require minimal dispersion and loss. It mainly uses hand to hand digital radio antennas, microstrip and stripline circuits, millimeter wave applications, missile guidance systems, military radar systems, and high-frequency circuit board for commercial aviation telephones.

Characteristics of RT/Duroid 5880 High Frequency PCB

a, Extremely low dielectric constant, measured at 10GHz, with a dielectric constant of 220+0.02:

b, Measured at extremely low dielectric loss of 10GHz, the dielectric loss factor is 0.0009.

Process Capability Parameters

Sequence  Number ProjectParameters
1Materials Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc
2Maximum Layer sample 36L/Batch 28L
3Maximum Plate ThicknessSamples 8.0mm/Batch 6.0mm
4Thinnest Plate Thickness2L-0.1mm
4L-0.4mm
6L-0.6mm
8L-0.8m
10L-1.0mmm
5Maximum Panel Size1200 * 610mm
6Minimum Line Width Line Spacing0.075mm (3mil)
7Minimum Pad Spacing0.1mm (4mil)
8Completed Aperture0.15mm-6.3mm
9Hole Wall Copper Thickness> 25um (1mil)
10Appearance Tolerance ± 0.1mm (4mil)
11Impedance Tolerance± 10%
12PTH Aperture Tolerance± 0.075mm (3mil)
13NPTH Hole Tolerance± 0.05mm (2mil)
14Hole Position Deviation± 0.05mm (2mil)
15Minimum Blind Buried Hole0.1mm (4mil)
16Plate Bending and Warping ≤ 0.7%
17Outer Copper Thickness 1oz-5oz
18Lnner Layer Copper Thickness1/2oz-4oz
19Outer Copper Thickness 12:01
20SMT Minimum Green Oil Width0.08mm
21Minimum Green Oil Window Opening0.05mm
22Special ProcessThick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc.
23Surface Treatment ProcessesInclude OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc.


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