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Antenna PCB
Line Width : 3MIL ;
Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Surface Technology : Gold deposition, Gold plating, Tin spraying, OSP ;
Processing Size : 600 * 1200mm ;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36 layers.
Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.
Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold
Line board antenna is to accept or send wireless signals antenna through the copper-clad plate etching process in the circuit board antenna, this antenna are integrated with the relevant electronic components, and in the form of modules to use, the advantages of its high degree of integration, can be compressed to reduce the volume of the cost, and the disadvantage is that the communication distance is limited to the low sensitivity, but in the short-distance remote control and communication, etc. is still widely used.
A method of fabricating an antenna circuit board, comprising the steps of: providing a rigid-flexible circuit board including a hardboard area and a softboard area, the hardboard area including at least one exposed first connection pad and at least one exposed second connection pad, and the first connection pad and the second connection pad are provided on opposite sides respectively; providing a conductive paste on a surface of the first connection pad, and affixing at least one antenna module to the conductive paste on the surface of the first connection pad.
The hardboard area includes at least one exposed first connection pad and at least one exposed second connection pad, and the first connection pad and the second connection pad are respectively provided on two back-to-back sides of the hardboard area; a conductive paste is provided on the surface of the first connection pad, and at least one antenna module is affixed with the conductive paste on the surface of the first connection pad to realize the electrical connection between the antenna module and the hardboard area; the antenna module is secured to the hardboard area through reflow soldering; a conductive paste is provided on the surface of the second connection pad, and at least one radio frequency integrated circuit module is affixed with the conductive paste on the surface of the second connection pad. conductive paste on the surface of the second connection pad, affixing the at least one RF integrated circuit module to the conductive paste on the surface of the second connection pad to electrically connect the RF integrated circuit module to the hardboard area: securing the RF integrated circuit module to the hardboard area by reflow soldering; filling a dielectric material between the gap between the antenna module and the hardboard area, and between the gap between the RF integrated circuit module and the hardboard area and curing it to form a dielectric layer.
