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What is the dielectric constant in a high frequency PCB? Detailed description

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Dielectric Constant, also known as Relative Dielectric Constant or Dielectric Constant (usually denoted as Dk or εr), is a physical quantity that describes the ability of an insulating material to store energy in an electric field. It is a dimensionless ratio that expresses the degree of polarization of a material, i.e., the ability to redistribute charge within the material under the action of an electric field.

Definition of Dielectric Constant:

The dielectric constant is a measure of the degree of polarization of a material, defined as the ratio of the capacitance of a material to its capacitance in a vacuum under the same conditions. Mathematically it can be expressed as: [ epsilon_r = frac{C_{ ext{material}}}{C_{ ext{vacuum}}}} ] where ( C_{ ext{material}}} ) is the capacitance in the material, ( C_{ ext{vacuum}}} ) is the capacitance in the vacuum.

The Role of Dielectric Constant in High Frequency PCBs:

In high frequency PCBs, dielectric constant has an important effect on signal transmission:

Signal Speed: 

Materials with lower dielectric constants reduce the reduction in the propagation speed of the signal through the medium, helping to maintain high speed signal transmission.

Signal Integrity: 

A low dielectric constant helps to reduce crosstalk between signals and signal attenuation, thus improving signal integrity.

Energy Storage: 

Materials with higher dielectric constants can store more electrical energy, but this can also lead to signal delays.

Effect of Different Dielectric Constants:

Low Dielectric Constant (Dk): 

Are often preferred in high frequency applications as they reduce the delay in propagation of the signal through the medium, reduce signal attenuation, and improve the rate and quality of signal transmission.

High Dielectric Constant: 

May be used in applications requiring high capacitance storage, but may result in slower signal speeds and degraded signal quality in high frequency signal transmission.


Dielectric constants of common high frequency PCB materials:

PTFE (Polytetrafluoroethylene) Substrates: 

Such as Rogers' RO4000 series, typically have a low dielectric constant of around 2.2 for high frequency applications.

Cyanate Ester Substrates: 

Such as Isola's IS series, may have a slightly higher dielectric constant, but still maintain a low dielectric loss factor for high-speed, high-frequency applications.

Other Materials: 

Such as Polyimide and some specialized composites, their dielectric constants may vary depending on the material formulation and structure.

In addition to dielectric constant, the selection of high frequency PCB materials involves several other key parameters that together determine the material's performance in high-frequency applications:

Dielectric Loss Factor (Df or tanδ): 

The dielectric loss factor is a measure of the energy loss of a material under the action of an electric field. The smaller the loss factor, the less energy the material loses during high-frequency signal transmission, thus helping to maintain signal integrity and reduce signal attenuation.

Coefficient of Thermal Expansion (CTE): 

The coefficient of thermal expansion describes the rate of change in volume or size of a material as temperature changes. Selecting a PCB material with a coefficient of thermal expansion similar to that of copper reduces board size changes due to temperature changes, thus maintaining circuit reliability and stability.

Moisture Absorption: 

Moisture absorption refers to the ability of the material to absorb moisture. High frequency PCB materials should have low hygroscopicity to avoid changes in humidity due to signal transmission performance degradation.

Thermal Conductivity: 

Thermal conductivity is a measure of the material's ability to conduct heat. High frequency circuits may generate more heat, so the choice of materials with good thermal conductivity to help dissipate heat to ensure the stable operation of the circuit.

Modulus of Elasticity: 

The modulus of elasticity is the ability of the material to resist deformation. In high frequency PCBs, a higher modulus of elasticity to help maintain the mechanical stability of the circuit board.


Good processability includes easy drilling, copper plating, lamination and other processes, which helps to improve productivity and yield.

Heat Resistance: 

Heat resistance refers to the material's ability to maintain unchanged properties at high temperatures. High frequency PCB materials should have sufficient heat resistance to adapt to the possible high-temperature working environment.


The stability of the material refers to the ability to keep its electrical properties unchanged under different environmental conditions. HF PCB materials should have good long-term stability to ensure that the circuit can work reliably in a variety of environmental conditions.

In high frequency PCB design, in addition to considering the material's dielectric constant, it is also necessary to comprehensively consider the other parameters mentioned above to ensure the performance and reliability of the circuit under high-frequency conditions. Designers usually choose the most suitable PCB material according to the specific application requirements and working environment.

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