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What is the Basic Manufacturing Process of PCB Circuit Board?

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The Chinese name of the PCB board for circuit boards, also known as circuit boards, is an important electronic components, so what is the basic process flow of pcb production, the following Xin Chenger Electronics will take you to understand.

The basic process flow of pcb production is mainly:the inner line → lamination → drilling → hole metallization → outer dry film → outer line → silk screen → surface process → after process

Inner layer line: the main process is to open the material → pretreatment → pressure film → exposure → DES → punching.

Lamination: Let the copper foil, semi-cured sheet and browning treatment of the inner layer of the circuit board pressed into a multilayer board.

Hole Drilling: Make PCB's interlayer produce through holes, can achieve connectivity between layers.

Hole Metallization: Metallize the non-conductor part of the hole, which can make the later plating process more convenient. If the production is a multi-layer PCB board, and contains buried holes or blind holes, each layer of the board must be drilled and plated before bonding. Without this step, there is no way to connect them to each other. After the holes have been drilled according to the drilling requirements by the machine, the inside of the hole must be plated (Plated-Through-Hole technology, PTH). Plated-Through-Hole technology (PTH) is a metal treatment on the inside of the hole, which allows the internal layers of wiring to be connected to each other. Before plating is started, it is necessary to remove debris from the hole. This is because the resin epoxy produces some chemical changes when heated, and it will cover the internal PCB layer, so it must be removed first. Both the removal and plating actions will be done in the chemical process.


Outer Dry Film: The desired lines are exposed on the dry film by the graphic transfer technique.

Outer Layer Circuit: The purpose is to plating the copper thickness to the thickness required by the customer to complete the circuit shape required by the customer.

Screen Printing: The protective layer of the outer layer of the line is used to ensure the insulation of the PCB, shielding and anti-soldering.

Post-processing: Finish the processing according to customer's requirement and test to ensure the final quality audit. Both THT and SMT parts are mounted on the PCB using machines and equipment.

THT parts are usually soldered using a method called Wave Soldering. This allows all parts to be soldered to the PCB in one pass, first cutting the pins close to the board and bending them slightly to allow the parts to be held in place. Next, the PCB is moved to a wave of fluxed solvent so that the underside is exposed to the flux, which removes any oxides from the bottom metal. After heating the PCB, this time it is moved to the melted solder, and after making contact with the bottom, the soldering is completed.

After contact with the bottom, the soldering is completed.

The automatic soldering of SMT parts is called Over Reflow Soldering. The paste containing flux and solder is processed once after the part is mounted on the PCB, and then again after the PCB is heated. To be cooled after the PCB welding is completed, the next step is to prepare for the final test of the PCB.

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