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What do I need to pay attention to during the gold plating process of printed circuit boards?

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The gold plating process for printed circuit boards (PCBs) is a critical step in ensuring board performance and reliability. In carrying out the plating process, the following important matters need to be noted:

Quality of Pre-treatment: 

Prior to gold plating, it is important to ensure that the copper surface is clean and free of oxides, and steps such as degreasing, micro-etching and activation are usually required. These steps are essential to ensure the quality of the subsequent nickel and gold immersion.

Nickel and Gold Immersion Process Control: 

Nickel and gold immersion are the two main stages in the gold plating process. In the nickel immersion process, the composition of the potion and the operating conditions, such as temperature, pH and stability of the plating solution, need to be strictly controlled. In gold immersion process, the concentration of gold, pH value and temperature should be controlled to ensure the uniformity and quality of the plated layer.

Plating Thickness: 

The thickness of the gold plating layer affects the board's solderability and resistance to discolouration. Different applications may require different thicknesses of gold, so the specifications of the plating should be clarified before production.

Plating Bonding: 

The bonding between the plated layer and the substrate is an important indicator of the performance of the plated layer. Insufficient bonding force may lead to plating off, affecting the reliability of the circuit board. Therefore, the plating process needs to be optimised to ensure good bonding.

Soldering Process: 

Since the gold layer will interact with the solder during the soldering process, the influence of the soldering process on the performance of the gold layer needs to be considered. Optimisation of the soldering parameters can improve the quality of the solder and the overall performance of the board.

Environmental Protection and Safety: 

During the gold plating process, environmental protection regulations should be observed, chemical wastes should be disposed of properly, and the safety of operators should be ensured. Use ventilation equipment, wear appropriate protective gear, and take necessary safety measures to prevent accidents.

Quality Inspection: 

After completing the plating, strict quality inspection should be carried out, including tests on the thickness, uniformity, bonding and solderability of the plated layer to ensure that the product quality meets the standards.

Continuous Improvement: 

With the development of technology and changes in market demand, new plating technology and materials should be explored and adopted continuously to improve product quality and production efficiency.

By strictly controlling the above matters, we can ensure that the plating process of printed circuit boards goes smoothly and produce circuit board products with excellent performance and reliability.


In addition to the above mentioned precautions, there are several other key points need to be noted in the printed circuit board (PCB) plating process:

Control of Impurities in The Plating Solution: 

Impurities in the plating solution, such as heavy metal ions, organics or other chemicals, may affect the quality of the gold plating layer. Therefore, the plating solution needs to be analysed and purified regularly to ensure its purity.

Maintenance of Equipment and Tools: 

Ensure that all plating equipment and tools are kept in good working condition. Regular maintenance and calibration prevents equipment failure, reduces the risk of production interruption and ensures consistent plating quality.

Control of Environmental Conditions: 

Temperature, humidity and other environmental factors affect the plating process and results. Workshop environmental conditions should be controlled within appropriate limits to minimise the impact of external factors on plating quality.

Precise Control of Process Parameters: 

The parameters in the plating process, such as current density, voltage, stirring speed of the solution, etc., need to be precisely controlled. Any small change may affect the performance of the plated layer.

Post-processing and Storage: 

Post-processing steps after plating is complete, such as cleaning, drying and subsequent surface treatment, are critical to maintain the solderability and extend the service life of the plated layer. In addition, PCB storage conditions should be properly controlled to prevent oxidation or other environmental factors from damaging the plating.

Records and Traceability: 

Keep detailed records of all important parameters and operating procedures during the production process so that the cause can be traced in case of problems and used as a basis for continuous improvement.

Employee Training: 

Ensure that operators are adequately trained on all critical points of the plating process and operating procedures to minimise human error.

By taking these factors into account and implementing effective management measures, you can ensure that the plating process of printed circuit boards achieves the best results and produces high-quality PCB products.

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