What are The PCB Processes in Detail?
PCB (Printed Circuit Board) processes mainly include the following:
Printed Circuit Board Manufacturing Process: Printed Circuit Board is the most common type of PCB, and its manufacturing process includes surface treatment, etching, drilling, plating and so on. Surface treatment is to make the copper foil and the substrate tightly combined to enhance its adhesion; etching is the unwanted copper foil corrosion, leaving the circuit graphics; drilling and plating is to realize the electrical connection and fixation of the circuit board.
Multilayer Circuit Board Manufacturing Process: Multilayer circuit boards are multiple single or double-sided boards stacked together by pressing and laminating to form a multilayer circuit board. The manufacturing process includes inner layer processing, press-fit, drilling, and outer layer processing. Inner layer processing is the inner layer of the board for processing, so that its surface is smooth and free of defects; press fit is the multilayer boards stacked together, through high temperature and high pressure for pressing; drilling and outer layer processing and single-panel manufacturing process is similar.
Flexible Circuit Board Manufacturing Process:Flexible circuit board is a PCB that can be bent and folded, and its manufacturing process includes thin film preparation, lithography, etching, film removal and so on. Film preparation is made of polyimide and other materials into a film; photolithography and etching is the unwanted film corrosion, leaving the circuit graphics; to remove the film is to remove the remaining film, exposing the copper foil.
Metal-based Circuit Board Manufacturing Process: Metal-based circuit board is a special type of PCB with metal as the substrate, its manufacturing process includes metal substrate processing, conductive layer production, protective layer production. Metal substrate processing is the metal substrate surface treatment, so that it has good conductivity and adhesion; conductive layer production is the metal powder and other materials coated in the metal substrate to form a conductive layer; protective layer production is the protective material coated in the conductive layer, to protect it from the effects of the external environment.
Thick-film Circuit Board Manufacturing Process: Thick-film circuit board is a special type of PCB, its manufacturing process includes thick-film printing, sintering, plating and so on. Thick film printing is a conductive material printed on the substrate, the formation of circuit graphics; sintering is a printed circuit graphics for high-temperature sintering, so that it and the substrate tightly combined; plating is to enhance the conductive properties of the circuit to improve its reliability.
Buried Resistive Circuit Board Manufacturing Process: Buried resistive circuit board is a resistive components buried in the PCB special types of PCB, the manufacturing process includes substrate preparation, resistive paste preparation, resistive component production, surface treatment and so on. Substrate preparation is made of insulating materials into the substrate; resistive paste preparation is a mixture of conductive materials and adhesives made of resistive paste; resistive element production is a resistive paste coated on the substrate, the formation of resistive components; surface treatment is to enhance the conductive properties of the circuit and adhesion.
PCB manufacturing process is a very complex process, involving multiple links and process requirements. In practice, it is necessary to consider the performance of the circuit, reliability, cost and many other factors to choose the appropriate manufacturing process to ensure the quality and reliability of the circuit board. At the same time, with the continuous progress of technology and application needs continue to improve, PCB manufacturing process is also constantly developing and improving to meet the changing market demand and technical requirements.
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