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What are the differences between Rogers RO4400 and RO4400T?

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Rogers RO4400 and RO4400T are two different prepregs (prepreg) produced by Rogers Corporation. They are mainly used in high-performance multi-layer printed circuit board (PCB) manufacturing. Here are the differences between RO4400 and RO4400T:

Material Composition:

RO4400 and RO4400T are both based on the RO4000 series of prepreg materials, which means they share many of the basic properties of the RO4000 series, such as low dielectric constant and dissipation factor, as well as good thermal properties.

Thickness Options:

The RO4400T may be available in thinner thickness options, which can increase flexibility in multi-layer designs, especially in RF applications that require more compact designs.

Coefficient of Thermal Expansion (CTE):

Both materials have a low Z-axis thermal expansion coefficient, which helps maintain the dimensional stability of the PCB at different temperatures. Specific CTE values may vary, but are designed to provide good reliability and performance.

Processing Capacity:

Both support multiple consecutive laminations, meaning they can be used to build complex multi-layer PCB structures. Lead-free soldering compatibility is also a common feature of both, which complies with current environmental and industrial standards.

Electrical Performance:

While specific dielectric constant (Dk) and dissipation factor (Df) values may vary, both are designed to provide excellent electrical performance, especially in high-frequency applications.

Application Areas:

Both materials are suitable for high-performance radio frequency and microwave circuits, including communication systems, high-speed computing, power amplifiers and more. They may be differently optimized in specific applications to meet different design needs.

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CAF Resistance Characteristics:

Both may be CAF (Conductive Anodic Filament) resistant, which is important for increasing PCB reliability and longevity.

Cost and Availability:

Due to differences in product positioning and features, there may be differences in cost and market positioning between RO4400 and RO4400T. Specific ordering cycles, prices and availability may vary.

Product Specifications:

Each material has its own specific product specifications, including size, thickness, electrical properties, etc., which will determine their suitability for a specific application.

Technical Documentation and Processing Guides:

Rogers Corporation provides detailed technical documentation and processing guidance for both materials to help manufacturers optimize the production process and achieve optimal performance.

Product Positioning:

The RO4400 series may include several different models designed to meet the needs of different RF and microwave circuit designs. The RO4400T, as one of the models, may have specific characteristics that make it more suitable in certain applications.

Electrical Performance Parameters:

According to the search results, RO4400T has a dielectric constant (Dk) of 6.15 (+/- 0.015) and a loss factor (Df) of 0.0038 @ 10GHz. These parameters are very important for high-frequency applications. Although the specific parameters of RO4400 are not provided, it can be speculated that the two may differ in these parameters.

Processing Compatibility:

Both mention compatibility with lead-free soldering processes, indicating that they are both designed to meet the environmental standards of modern electronics assembly.

Multilayer Board Design:

The search results mention that RO4400 series prepregs are compatible with laminates such as RO4003C, RO4350B, RO4835™, RO4360G2™ or RO4000 LoPro® for building multi-layer boards. This shows that both RO4400 and RO4400T are suitable for the manufacturing of high-performance multilayer boards.

Heat Treatment Capacity:

Both support multiple consecutive laminations, which likely means they exhibit good stability and consistency during heat treatment and lamination.

Application Advantages:

Search results highlighted the benefits of RO4400 series prepregs in improving the performance of multilayer board designs, including reduced conductor losses, improved signal integrity and reduced passive intermodulation (PIM) performance.

CAF Resistance Characteristics:

CAF resistance is very important to prevent the formation of conductive anode filaments, which may be reflected in both RO4400 and RO4400T.

Technical Specifications and Processing Guidelines:

Technical documentation and processing guides provided by Rogers Corporation may detail specific specifications and best processing practices for RO4400 and RO4400T.

Market Application:

Both are suitable for high-performance electronic solutions such as radio backhaul, communications systems, high-speed computing, IP infrastructure, power amplifiers, small cells/distributed antenna systems (DAS), and test and measurement.

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