These Layers Play Their Own Unique Roles in The PCB as Follows
Function: Provide a stable power supply and a clean and stable reference voltage for all devices.
Signal Integrity: Provide a low impedance return path for high-speed signals, making it possible to transmit high-speed digital signals.
EMI (Electromagnetic Interference): Provides a return path with minimal impedance for high-speed currents, reducing the area and impedance of the loop and thus reducing the radiation from the loop.
Mechanical Reinforcement Layer:
Role: The main purpose is to increase structural strength and stiffness to control structural displacement.
Application: Usually used in some specific parts of high-rise buildings, such as the equipment floor or refuge floor space, to strengthen the connection between the core and the frame columns by setting up horizontal outstretched members with larger stiffness.
Drill hole drawing layer and drill hole location layer:
Role: Used to draw drill hole diagrams and drill hole locations to ensure accurate information about drilling holes in the circuit board manufacturing process.
Screw hole layer:
Role:Provides guidance for screw installation.
Function:Provides guidance for through-hole installation.
Function: To meet the specific needs of the PCB manufacturing and assembly process, to improve the performance and reliability of the PCB.
Function: Soldermask layer is a layer that protects copper conductors from corrosion by solder. On the pads, it prevents solder from spilling over and improves the appearance of the solder.
Color: Usually green, which is why we see PCBs with a green overlay.
Solder Paste Protection Layer
Role: This layer is mainly used for the pads of surface mount components to avoid solder paste overflow.
Color: Usually yellow.
Role: This layer is used to print text and graphics on the PCB, such as component number, component location, etc., in order to facilitate manual identification.
Color: Usually White.
Prohibit Wiring Layer:
Role: This layer is used to define the electrical characteristics of the copper side of the boundary, to ensure that the wiring will not go beyond a specific area.
Role: Multi-layer PCBs consist of multiple conductive layers that are separated by insulating materials and connected by vias or through-holes between the layers. The purpose of multi-layer is to increase the PCB wiring space and enhance its mechanical properties.
Role: This layer is mainly used to describe the mechanical dimensions and assembly requirements of the entire PCB.
Other Special Layers:
Role: Special layers set according to specific needs, such as metallized holes, blind holes, etc., used to meet specific manufacturing and assembly needs.
Electrical Test Layer:
Role: Used in the manufacturing process for electrical testing to ensure that the conductivity of the PCB is normal.
Role: Used to guide the installation and fixation of components to ensure that the components are correctly and stably installed on the PCB.
Role: used to add notes and instructions to help understand and explain the design of the PCB.
Role: used to protect the PCB from environmental factors (such as moisture, corrosion, etc.) to improve its durability.
Role: used to calibrate and adjust the PCB manufacturing process of various parameters and tools to ensure manufacturing accuracy and quality.
Thermal Design Layer:
Role: used to evaluate and optimize the thermal performance of the PCB, to ensure that in normal operation will not overheat.
Signal Integrity Analysis Layer:
Role: used to analyze and optimize the signal integrity, to ensure the quality and performance of high-speed signal transmission on the PCB.
Package Library Layer:
Role: used to define and describe the component package type and size, to ensure that the components can be properly installed on the PCB.
Layout Reference Layer:
Role: Used to provide reference and benchmark for PCB layout, to ensure the accuracy and consistency of the layout.
The existence of these layers makesPCB designmore flexible and powerful to meet the needs of a variety of different applications. In the design and manufacturing process, the rational use of these layers can significantly improve the performance and reliability of the PCB.
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