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There are Significant Differences Between Microwave RF PCBs and Ordinary PCBs.

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Operating Frequency: The operating frequency of microwave RF PCBs is usually in the frequency band of several hundred megahertz to several gigahertz, while the operating frequency of ordinary PCBs is usually lower.

Bandwidth Requirements: Microwave RF PCBs require broadband operation with high bandwidth requirements, while ordinary PCBs have relatively low bandwidth requirements.

RF Power: The RF power of microwave RF PCBs is generally lower, while ordinary PCBs have higher RF power.

Anti-jamming Ability: Since microwave RF PCB works in high frequency band, the signal is easy to be interfered and attenuated, so it needs higher anti-jamming ability. And ordinary PCB due to the lower operating frequency, by the interference and attenuation is relatively small.

Packaging and Heat Dissipation: Microwave RF PCBs require higher packaging requirements and heat dissipation capabilities, because high-frequency signals are susceptible to loss and attenuation in the packaging and transmission process. At the same time, due to the high operating frequency, microwave RF PCB power consumption is also larger, need better heat dissipation to ensure the stability and reliability of the chip. Ordinary PCB in this regard, the requirements are relatively low.

Manufacturing Process: Microwave RF PCB requires high-precision manufacturing processes, such as high-precision drilling, line production and surface treatment to ensure electrical performance and stability. The manufacturing process of ordinary PCBs is relatively simple.

There are some differences in the manufacturing process of microwave RF PCB and high frequency microwave PCB, mainly in the following aspects:

Cutting: According to the board material required for engineering designcutting, corner grinding, edge shaving and other processing is performed to generate the required substrate size. At this stage, in order to avoid board edge burrs affecting quality, edge grinding and corner rounding are usually required after cutting.

PCB-37

Inner Layer Line Production: A photographic dry film is applied to the copper board, and then the line pattern is produced through exposure and development. This step is the process of transferring the inner circuit pattern to the PCB.

Drilling: Holes are drilled in the substrate according to the design requirements to mount electronic components. For high-frequency microwave PCBs, the drilling needs to be highly accurate to avoid interference with signal transmission.

Impedance Processing: During the drilling process, impedance processing must be performed to ensure proper transmission of the circuit. This is to ensure impedance matching and signal integrity of the circuit.

Pressing: PP sheets are pressed together through high temperature and pressure to ensure the adhesive strength of the inner core board.

Brown-out: Using chemical principles to generate an oxide layer on the clean copper surface to ensure the quality of the subsequent etching process.

Etching: Use chemical etching solution to treat the oxide layer to remove the oxide layer and expose the copper surface.

Pressing: The use of compression adhesive PCB boards and circuit boards pressed together to ensure the strength of the circuit connection.

Surface Treatment: The surface of the circuit board is cleaned, dried and coated to improve the performance and reliability of the circuit board. For high-frequency microwave PCBs, special surface treatment techniques may be required to minimize signal attenuation and distortion.

Inspection: The circuit board is inspected to ensure that it meets the design requirements and necessary corrections are made.


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