PCB Production of The Specific Process and Notes on The Inner Layer of The Line

The specific flow of PCB fabrication of inner layer lines includes the following steps:

Cutting: According to the engineering design of the required board materials, cutting, grinding corners, edge planing and other processing, in order to generate the required size of the substrate.

Inner Layer Line Production: Coat the photographic dry film on the copper board, and then produce line graphics through exposure and development.

Drilling: Holes are drilled in the substrate according to the design requirements to mount electronic components.

Impedance Treatment: During the drilling process, impedance treatment must be carried out to ensure the normal transmission of the circuit.

Pressing:PP sheets are pressed together through high temperature and pressure to ensure the adhesive strength of the inner core board.

Brown-out: Using chemical principles to generate a layer of oxide on the clean copper surface to ensure the quality of the subsequent etching process.

Etching: Use chemical etching solution to treat the oxide layer to remove the oxide layer and expose the copper surface.

Pressing: The use of compression adhesive will be PCB board and circuit board pressed together to ensure the strength of the circuit connection.

Drilling: Drill holes in the circuit board according to the design requirements to connect external circuits.

Surface Treatment: Cleaning, drying and coating the surface of the circuit board to improve the performance and reliability of the circuit board.

Precautions:

In the process of opening, it should be ensured that the size and shape of the substrate meet the requirements to avoid bending, deformation and other problems.

In the process of inner layer line production, it should be ensured that the coated dry film is uniform, bubble-free and free of impurities to improve the precision and reliability of the line.

In the drilling process, it should be ensured that the position, diameter and depth of the drilled holes are in accordance with the design requirements to avoid deviation or damage to the circuit board.

In the impedance processing process, it should be ensured that the impedance value meets the design requirements to avoid impacting the circuit performance.

In the pressing process, it should be ensured that the PP sheet is closely adhered to the substrate to avoid bubbles or delamination.

In the browning process, it should be ensured that the copper surface generates a uniform oxide layer to improve the etching quality and circuit accuracy.

During the etching process, it should be ensured that the concentration, temperature and etching time of the etching solution meet the process requirements to avoid excessive or insufficient etching.

In the press-fit process, the quality of the press-fit adhesive and coating uniformity should be ensured to avoid leakage or overflow of adhesive.

In the drilling process, it should be ensured that the drilling position is accurate, the hole diameter is suitable, and the depth is appropriate to avoid the impact on the circuit performance.

In the process of surface treatment, it should be ensured that the surface is evenly coated, adequately dried, and free of scratches or residues and other problems.

In general, the production of the inner layer of the circuit is one of the important parts of the PCB production process, and it is necessary to strictly control the process parameters and operating procedures to ensure that the inner layer of the circuit produced has high precision, high reliability and good electrical performance. At the same time, it is also necessary to pay attention to safety and environmental issues, and take appropriate measures to ensure production safety and environmental protection.