PCB Gold Plating Process and Precautions
The gold layer on the PCB mainly includes a conductive layer and an anti-corrosion layer. Conductive layer is mainly used to ensure the stability and reliability of the circuit, usually in the circuit interface, connection points and important components on the gold-plated, in order to reduce the contact resistance, improve conductivity. Anti-corrosion layer is mainly used to protect the PCB surface, to prevent oxidation and corrosion, usually in the whole PCB surface plated with a thin layer of gold.
In selecting the number of layers of gold plating, you need to consider the cost, performance and reliability factors. If you need higher performance and reliability, you can choose to increase the number of layers of gold plating. However, factors such as cost and environmental protection also need to be considered. In some cases, you can also choose to use other metals instead of gold, such as silver, copper, etc., to reduce costs.
PCB gold plating process mainly includes the following steps:
Surface Treatment Before Plating: This step is critical, and must be thoroughly cleaned and degreased to ensure metal adhesion.
Current Stability and Electrolyte Formulation Control During Plating: Must be strictly controlled to ensure the quality of gold plating.
Cleaning and Drying After Plating: This step must be carried out thoroughly to ensure the quality and luster of the metal layer.
PCB Gold Plating Process in a Closed Environment: To avoid the interference of external impurities.
Temperature and Time Control: The temperature and time control of the gold plating process is also critical and needs to be adjusted according to the specific situation.
In the production process, the following matters need to be noted:
In the production of full-board electroplating hard gold, you need to use GPM-220 resist gold dry film, and according to the specific circumstances to choose whether to carry out the second dry film.
For the whole board does not print solder resist products, no need for the second dry film; while there is solder resist products, the second dry film only do solder resist pads open window position, do not need to do the whole board.
In the production of the whole board plating soft gold, also need to use GPM-220 anti-electro-gold dry film, and according to the specific circumstances to choose whether to carry out the second dry film.
In the production process, the temperature and time need to be strictly controlled to avoid high temperature leading to deformation of the substrate or blistering of the plating layer and other problems.
In the production process, need to pay attention to prevent external impurities and oil pollution, so as not to affect the quality of the coating and adhesion.
In the production process, you also need to pay attention to the protection of line design and pad location, to avoid improper operation of the line breakage or pad location offset and other issues.
In the production process, you need to select the appropriate coating thickness and material according to the specific circumstances to meet different needs and specifications.
In the production process, you also need to pay attention to safety issues, such as wearing protective clothing, the use of safety supplies, etc., in order to avoid the occurrence of safety accidents.
The PCB plating process requires strict control of parameters such as temperature, time, electrolyte formulation, as well as attention to details such as surface treatment, closed environment, etc., in order to ensure the quality and adhesion of the plating layer. At the same time, it is also necessary to pay attention to safety issues in the production process and follow the relevant regulations and operating procedures.
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