PCB Etching Process and Precautions
PCB etching process includes the following steps:
Prepare the etchant, usually use ferric chloride, environmental protection etchant, hydrochloric acid + hydrogen peroxide and so on.
Put the prepared board into the etchant, make sure to cover the copper metal surface completely.
Maintain the proper temperature and time, usually heated to about 100°F (38°C), the etching process usually takes 15~20 minutes. Gently stir the liquid in the container and check the etching every short while.
When satisfied with the etching, remove the board from the container and wash it with water.
When the board is dry, use acetone (or another solvent) to wash the toner off the board. Then, wash the board again with water.
Once cleaned and dried, you can drill holes in the board and solder components as needed. It is best to perform these tasks soon after etching. If the interval is too long, a layer of copper oxide will form on the surface of the circuit board, which will adversely affect component soldering.
The etchant is strongly corrosive and needs to be used with extreme care to avoid contact with skin or eyes.
In the etching process, you need to maintain the appropriate temperature and time to avoid excessive temperature or time leading to excessive corrosion of the circuit board.
Before etching, you need to ensure that the circuit board surface is clean and free of contaminants, otherwise it will affect the etching effect.
In the etching process, you need to pay attention to safety issues, such as avoiding the use of sharp tools, to avoid dropping the circuit board.
After etching needs to be cleaned, otherwise it will have an impact on the subsequent process and circuit performance.
For different types of circuit boards and different etching agents, it is necessary to use different etching processes and techniques, should fully understand the characteristics of the material and process requirements.
During the etching process, proper agitation should be maintained to promote the chemical reaction between the etchant and the copper metal to improve the etching effect.
After etching should be carried out in a timely manner for subsequent processes, such as drilling, welding, etc., to avoid placing too long to cause oxidation of the surface of the board.
For multi-layer boards or special boards, it is necessary to use special etching processes and techniques, such as layered etching, chemical etching, etc., to ensure that the PCB produced meets the requirements.
In the etching process, attention should be paid to the treatment of waste gas and waste liquid, and appropriate environmental protection measures should be taken to ensure environmental protection and safety in the production process.
In general, etching is an important part of the PCB production process, you need to follow the corresponding process requirements and technical specifications to ensure that the production of PCB quality and reliability. At the same time, also need to pay attention to safety issues and environmental issues, take appropriate measures to ensure that the production process of safety and environmental protection.
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