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PCB Circuit Board Salesman Essential Knowledge(二)

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PCB circuit board salesman should have the following basic knowledge:

D. The classification of printed circuit boards: Master the different types of printed circuit boards, such as single-panel, double-sided boards and multi-panel, as well as their characteristics and application scenarios.

PCB circuit boards can be categorized into different types of printed boards such as single panel, double-sided boards and multilayer boards according to the distribution of conductive paths. They each have different characteristics and application scenarios.

Single-panel is the simplest PCB board, it is only in the insulating substrate side of the copper foil, the formation of conductive paths. Therefore, the wiring of single panel can only be carried out on one side, and the design is relatively simple. Single-panel is usually used in applications that do not require high circuitry, such as radios and televisions. It has a low manufacturing cost and is suitable for mass production and consumer electronics applications.

Dual-sided panels have copper foils laid on both the front and back sides of the insulated substrate to form a conductive path. Compared to single-sided panels, double-sided panels have a higher wiring density, allowing for more complex circuit connections. Double-sided panels are suitable for general requirements of electronic products, such as electronic computers, electronic instruments and meters. Due to the high wiring density of double-sided boards, the size of the device can be reduced and the performance of the whole machine can be improved.

Multilayer boards, on the other hand, are PCB boards consisting of multiple layers of conductive paths and insulating layers. Multilayer boards allow for higher density wiring and are suitable for electronic products that require high integration and miniaturization, such as smartphones and tablet PCs. Multilayer boards also have good electrical properties and mechanical strength, which can improve the reliability and stability of the whole machine. The manufacturing cost of multilayer boards is higher, but more complex functions and higher performance can be realized.


E. The manufacturing process of printed circuit boards: understand the production process of printed circuit boards, including design, documentation, manufacturing and testing, and how these links affect the quality and cost of the final product.

The printed circuit board (PCB) manufacturing process is a complex and delicate process that involves a number of components such as design, documentation, manufacturing and testing. These steps are interrelated and together affect the quality and cost of the final product. The following is a brief description of each link:

Design: 

The design session is the first and most critical step in the PCB production process. Designers need to determine the layout of the circuit, the direction of the wire, component selection, etc., according to the functional requirements of the circuit and performance requirements. The quality of the design directly affects the performance, reliability and stability of the final product. Therefore, the design phase needs to fully consider a number of factors such as electrical performance, mechanical strength, heat dissipation performance, maintainability and so on. Optimization and improvement in the design phase can significantly reduce the cost of subsequent manufacturing and testing sessions.

Documentation: 

The documentation session is the process of translating design results into the documents and data required for actual production. This includes the generation of circuit patterns, drill files, BOMs (Bill of Materials), etc. The quality of documentation directly affects the accuracy and efficiency of the subsequent manufacturing process. Errors or omissions in documentation can lead to rework, scrap, and other problems in the manufacturing process, which can increase costs.

Manufacturing: 

The manufacturing session is the process of converting design files into actual PCB boards. This includes substrate preparation, circuit pattern transfer, etching, drilling, soldering and many other steps. Quality control in the manufacturing process is critical to the quality and performance of the final product. If quality problems occur during the manufacturing process, such as shorted or broken wires, the entire PCB board may be scrapped. Therefore, the manufacturing process requires strict control of process parameters and enhanced quality testing to ensure product quality.

Test link: 

Test link is to manufacture the completed PCB board for electrical performance, mechanical strength and other aspects of the test. The purpose of the test is to ensure that the PCB board meets the design requirements, can work properly. Test session can be found in the manufacturing process there may be quality problems, and timely rework or repair. The quality and efficiency of the testing session directly affects the quality and cost of the final product. If there are omissions or errors in the testing session, it may lead to the flow of defective products into the market, affecting the reputation and sales of the product.

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F. The terminology of printed circuit boards: a good grasp of the terminology related to printed circuit boards, such as electrical boundaries, solder resist graphics, pads, through-holes, etc., as well as their uses and technical details.

In printed circuit board (PCB) manufacturing, familiarity with and mastery of the relevant terminology is critical to understanding the design requirements, manufacturing processes and quality control. Below are some of the terminology related to PCBs, as well as their uses and technical details:

Electrical Boundary 

Purpose: Electrical Boundary defines the effective working area of a circuit on a PCB, ensuring that all circuit components and wires are located within a predetermined area, preventing the circuit from shorting out or interfering with external objects.

Technical Details: Electrical boundaries are usually defined by boundary drawing tools in design software and realized in production in the form of actual physical boundaries, e.g. formed by cutting or etching the substrate.

Solder Mask

Purpose: Solder Mask is used to cover non-soldered areas of a PCB to prevent accidental flow of solder during the soldering process to areas that do not need to be soldered, e.g. between wires or component pins.

Technical Details: Soldermask is usually applied in a separate step in the PCB manufacturing process, whereby the soldermask material is covered on the PCB surface by means of screen printing or spraying, and then openings are made where soldering is required.

Solder Pad

Purpose: A solder pad is a metal area on a PCB used for soldering the pins of electronic components. The design of the pad determines the reliability of the soldering and the quality of the electrical connection between the component and the PCB.

Technical Details: The size, shape and position of the pads are determined by the size, shape and spacing of the component pins. Solder pads are usually made of copper and may be surface treated to improve solderability.

Through Hole (Via)

Purpose: A via is a conductive path in a PCB that penetrates the entire board thickness and is used to connect conductive paths between different layers.

Technical Details: Through-holes can be metallized or non-metallized. Metallized through-holes (i.e. plated through-holes) are filled with conductive metal for electrical connections; non-metallized through-holes are typically used for mechanical fixing or heat dissipation. The formation of through-holes can be achieved by drilling, laser machining or etching.

These specialized terms are an integral part of the PCB manufacturing and design process. Mastering these terms helps to better understand the working principle, manufacturing process and quality control requirements of PCBs, thus ensuring that the PCBs produced meet the design requirements and can perform well in practical applications.


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