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In Custom PCB, What is the Solution if the Line Width is too Thin?

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In the process of customizing PCB, if you encounter the problem that the line width of the circuit board is too thin, you can take the following solutions:

Adopting a more Refined Manufacturing Process: 

using thin or ultra-thin copper foil substrates and fine surface treatment technology, as well as thinner dry film and wet film lamination processes, can reduce line width distortion and defects, and improve wire integrity and accuracy.

Using Electrodeposited Photoresist Film (ED): 

ED technology can control the thickness within the range of 5 to 30 microns, produce finer wires, and is suitable for narrow ring width, no ring width and full-board electroplating.

Parallel Light Exposure Technology: 

The use of parallel light exposure technology can overcome the influence of line width variation caused by point light sources, and obtain conductors with precise line width and smooth edges.

Automatic Optical Detection Technology: 

Using automatic optical detection technology as an essential means of detection in fine wire production can improve production quality.

Microvia Technology: 

Turning to microvia technology to improve densification, especially when wire and pad densification reaches a certain limit, microvia technology can further improve densification.

CNC Drilling Machine and Micro Drill Bit Technology: 

Using advanced CNC drilling machines and excellent micro drill bits can improve the manufacturing efficiency and quality of micro holes.

Buried, Blind, and Through-hole Technology: 

Combining buried, blind, and through-hole technologies can increase the density of printed circuits, reduce the number of through-holes, and increase the number of effective wiring and inter-layer interconnections.

Optimize Wiring Design: 

During the design stage, consider the current carrying capacity and signal integrity, and appropriately increase the line width of key lines to avoid burnout problems caused by too thin line widths.

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Adopt Multi-layer PCB Design

By increasing the number of PCB layers, more wiring space can be provided without increasing the complexity of a single layer.

Cooperate With Professional PCB Manufacturers: 

Choose an experienced PCB manufacturer who can provide professional design advice and technical support to help solve the problem of too thin line width.

Optimize PCB Layout: 

Re-layout the design to avoid overly dense areas and ensure enough space for wider traces.

Use Wide-line Designs: 

Use wide-line designs on critical power and ground lines, as well as lines with higher currents, to reduce resistance and improve current carrying capacity.

Increase the Number of Vias: 

Increase the number of vias in dense areas to achieve better current distribution and reduce the need for line width.

Use High Conductivity Materials: 

Use high conductivity copper foil materials to increase current carrying capacity, allowing for the use of thinner lines.

Adjust Design Rules: 

Adjust design rules in EDA (electronic design automation) software to ensure that line width limitations are taken into account during the design process.

Use a Differential Pair Design: 

For high-speed signal transmission, using a differential pair design can reduce signal interference and improve signal integrity.

Use Impedance Control Technology: 

Impedance control technology ensures the impedance matching of signal transmission lines, thereby reducing signal reflection and attenuation.

Optimize Signal Integrity: 

Optimize signal integrity through simulation and analysis to ensure the stability and reliability of the signal during transmission.

Increase Heat Dissipation Design: 

For lines with larger currents, add heat dissipation design, such as heat dissipation holes, heat sinks, etc., to reduce the risk of line burnout due to overheating.

Use Advanced Manufacturing Technologies: 

Such as semi-additive method (SAP) and additive method (MSAP), which can provide finer lines and spaces and are suitable for high-density PCB design.

Work Closely With the Design Team: 

Maintain close communication with the design team to ensure that the design intent is accurately realized while solving problems that may arise during the manufacturing process.

Conduct Prototype Testing: 

Before mass production, prototypes are made and tested to verify the effectiveness and manufacturability of the design.

Continuous Process Improvement: 

Work with manufacturers to continuously improve manufacturing processes to adapt to changing design needs and technological advancements.

Use Modular Designs: 

Where possible, use modular designs to simplify the production process and reduce the need for delicate wiring.

Through these strategies, the problem of too thin lines can be effectively solved and the reliability and performance of PCB can be improved. However, each solution has its applicable scenarios and limitations, so factors such as design requirements, cost, production capacity, and time need to be considered when selecting a solution.

Xinchenger Electronics Co., Ltd. has more than fifteen years of experience in PCB production and has complete PCB process equipment. It has Rogers high-frequency sheets, RO3000, series, RO4000 series, RO5000 series, etc. all year round, with dielectric constants ranging from 2.2-10.6. If you have any needs for PCB high frequency boards, RF PCB and other circuit boards, please come to us for customized drawings. Welcome to inquire!

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