How to Manufacture Multilayer PCB High Frequency Boards? What are The Differences in The Process Flow?

Due to the complex manufacturing process of multi-layer PCB high frequency boards, different layers of PCB high frequency boards also have different manufacturing processes. According to the different layers of PCB, they are divided into single panel, double-sided board, and multi-layer board. In the process flow, these three types of boards are different. At the same time, there is no inner layer process for single and double panels, and the basic process is cutting, drilling, and subsequent processes; Multilayer boards will have inner layer processes.

A. Single Panel Process Flow：

Cutting and grinding →drilling→ outer layer graphics → (full plate gold plating → etching → inspection → silk screen resistance welding → (hot air leveling → silk screen characters → contour processing →testing→ inspection).

B. Process Flow of Double-sided Tin Spraying Board：

Cutting and grinding → drilling → copper sinking and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen resistance welding → gold-plated plug → hot air leveling → silk screen characters → appearance processing → testing → inspection.

C. Process Flow of Nickel Gold Plating on Souble-sided Boards：

Cutting and grinding → drilling → copper sinking and thickening → outer layer graphics → nickel plating, gold film removal and etching → secondary drilling → inspection → silk screen resistance welding → silk screen characters → contour processing → testing → inspection.

D. Process Flow of Multi-layer Tin Spraying Board：

Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → copper deposition and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen resistance welding → gold plated plug → hot air leveling → silk screen characters → external processing → testing → inspection.

E. Process Flow of Nickel Gold Plating on Multi-layer Boards：

Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → copper deposition and thickening → outer layer graphics → gold plating and film removal etching → secondary drilling → inspection → silk screen resistance welding → silk screen characters → external processing → testing → inspection.

F. Process Flow of Multi-layer Nickel Gold Plate Sinking：

Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → copper deposition and thickening → outer layer graphics → tin plating, etching and tin removal → secondary drilling → inspection → silk screen resistance welding → chemical nickel gold deposition → silk screen characters → external processing → testing → inspection.

Shenzhen Xinchenger Electronics Co., Ltd. is a professional manufacturer of 2-36 layer high-frequency PCB boards. It can produce PCB boards, high frequency boards, special circuit boards, microwave RF boards, antenna boards and other products on an expedited basis. The company has regular stocks of high frequency boards such as Rogers, TACONIC, F4B, TP-2, FR-4, and the dielectric constant ranges from 2.2-10.6.

Specializing in providing high frequency PCB circuit board circuit board, Rogers high frequency board, Taconic high frequency board, F4B/Teflon high frequency board, microwave RF board, special circuit board,etc.. If you need, please feel free to inquire!