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High Frequency PCBs What are the choices in raw materials?

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The choice of raw materials for HF PCBs is critical to the performance of the circuit, especially in applications with high electromagnetic frequencies, such as communications, automotive radar, and satellite systems. 

Here are some common raw material choices for HF PCBs:

Polytetrafluoroethylene (PTFE) Substrate: 

PTFE has a very low dielectric constant and dielectric loss, as well as good chemical and thermal stability, is the material of choice for high frequency applications.

Rogers Materials: 

Such as RO4003, RO3003, RO4350, RO5880, etc., these materials are designed for high-frequency applications, providing low loss factor and strict thickness control.

TUC Materials: 

Such as TUC862, 872SLK, 883, 933, etc. These materials are also suitable for high frequency PCBs.

Panasonic Materials: 

E.g. Megtron 4, Megtron 6, etc. These materials provide stable dielectric properties.

Isola Materials: 

Such as FR408HR, IS620, IS680, etc. These materials provide good electrical characteristics and processing performance.

Nelco Materials: 

Such as N4000-13, N4000-13EPSI, etc. These are suitable for high performance PCB applications.

Epoxy Resins (EP): 

Some modified epoxy resins are also used for high frequency PCBs, modified to reduce dielectric constant and dielectric loss.

Bismaleimide Triazine Resins (BT): 

Provide good dielectric properties and high temperature resistance.

Thermoset Cyanurate Resins (CE): 

Used for high performance PCBs, providing excellent electrical insulation and high temperature resistance.

Thermoset Polyphenylene Ether Resin (PPE): 

With low dielectric constant and good thermal stability.

Polyimide Resin (PI): 

Suitable for flexible PCB boards in high temperature environments.

Brand-specific High-frequency Materials: 

Such as AGC's Meteorwave line of products, these materials are designed for use in high-speed digital PCBs and are available in different grades of surface roughness and types of copper cladding to meet the needs of different applications.

The choice of these materials depends on the specific application requirements, cost budget and manufacturability. High frequency PCB designers need to strike a balance between these factors to ensure the performance and reliability of the final product.


Thermoset PPO (Polyphenyl Oxide): 

Provides excellent electrical insulation properties and can be used to manufacture HF PCB substrates.

Cross-chained Polybutadiene Substrates: 

These materials can be used in the manufacture of high frequency PCBs, providing good dielectric properties.

Epoxy Resin Composite Substrates (FR-4): 

Although FR-4 is not specifically designed for high frequency applications, it can be used for certain high frequency PCBs through improvement and optimization.

Aaron 85N: 

This is a high performance PCB material for high frequency applications.

Specific Modified Resins: 

Reducing the concentration of polar groups in the resin through chemical modification can improve dielectric properties and reduce dielectric constant and dielectric loss factor.

Hollow Glass Fiber: 

The use of hollow glass fiber can reduce the dielectric constant of the composite material, thus improving the performance of high frequency PCBs.

Multi-layer Dielectric Distribution: 

Through the reasonable adjustment of the distribution of multi-layer dielectric, you can reduce the cost while improving the dielectric properties of the substrate.

Overall Improvement of Substrate Materials: 

In addition to the modification of the substrate itself, the overall structure of the substrate can also be improved to improve its dielectric properties.

Specialty Copper Clad Types: 

Such as MLSG3 / RTF2, HS1-MS1-VSP, SI Copper, Double Treat, Grade 3 HTE Shiny, Ohmega Ply, NiCr Ticer TCR, etc. These copper clad types can provide specialty properties such as improved signal transmission quality or increased heat resistance.

Surface Treatment Technologies: 

Such as Immersion Gold, OSP (Organic Protective Sheet), Hard Gold, Immersion Silver, Enepig, etc. These surface treatment technologies can improve the solderability and long-term reliability of PCBs.

Impedance Control: 

The dielectric properties of the material are critical to the PCB's impedance control, which needs to be precisely controlled to meet the requirements of high-speed signal transmission.

Environmental Adaptability: 

HF PCB materials also need to be considered for their performance stability in different environmental conditions, such as moisture resistance and heat resistance.

Selecting the right HF PCB material is a comprehensive process that takes into account electrical properties, mechanical properties, thermal properties, cost and processability. Designers need to select the most suitable material according to specific application scenarios and performance requirements.

Xinchenger Electric is a professional 2-36 layer high frequency PCB circuit board manufacturer, can expedite the production of high frequency PCB boards, mixed pressure high frequency boards, special circuit boards, microwave RF boards, microwave antenna boards and other products, the company is always on hand: Rogers, Taconic, F4B, TP-2, FR-4 and other high frequency boards.Welcome to inquire!

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