High frequency PCB professional production process

The intellectual manufacturing process of high frequency PCB (Printed Circuit Board) is a series of complex process steps, involving material selection, processing technology, precise control and other aspects. 

The following are the detailed steps of the Smart Manufacturing Process for High Frequency PCBs organized according to the search results:

Raw Material Selection:

Selection of substrates suitable for high-frequency applications, such as PTFE (polytetrafluoroethylene), these materials have a low dielectric constant and low dielectric loss.

Adhesive Mixing:

Mix special resins, solvents, and fillers in a certain proportion and stir to form a viscous adhesive.

Gluing and Drying:

The mixed glue solution is used to dip-coat the glass fiber cloth to make it adhere to the glue, and then dried at high temperature to become the bonding sheet.

Cutting and Stacking of Bonding Sheets (Book Building):

After drying, the bonding sheet is cut and laminated with copper foil to form a multi-layer structure, and then transported to the clean room.

Lamination:

The stacked semi-finished products are sent to the hot press for hot pressing to make the layers bonded together in a high temperature, high pressure and vacuum environment.

Shearing:

After cooling, trim the edges of the products and cut them into the corresponding sizes according to customers' requirements.

Drilling:

Use mechanical drilling or laser drilling technology to drill the required holes in the PCB board.

Copper Deposition:

Chemical deposition of a copper layer on the walls of the holes in preparation for subsequent plating.

Electroplating:

Electrochemically plating a copper layer on the hole wall and outer copper surface to enhance electrical conductivity and mechanical strength.

Graphics Transfer:

The transfer of circuit graphics to the PCB surface using photoresist, exposure, and development steps.

Etching:

Using chemical or mechanical methods to remove the copper layer not protected by photoresist to form circuit graphics.

Solder Resist Fabrication:

Protecting areas not to be soldered by printing or spraying solder resist.

Text Printing:

Printing logos, model numbers, and other information on the PCB.

Flying Probe Testing:

Testing the electrical properties of the board using a flying probe tester.

Molding:

Process the shape of the PCB according to the design requirements, such as cutting, milling, etc.

Final Inspection:

Conduct a comprehensive quality inspection of the completed PCB to ensure compliance with technical specifications.

Packing for Shipment:

Pack the qualified PCB boards appropriately and prepare them for shipment.

Raw Material Formulation: 

The selection and formulation of raw materials directly affects the dielectric constant and dielectric loss of the copper-clad board, which is one of the key factors in the performance of high-frequency PCBs.

Resin Selection: 

Use low dielectric constant and low loss resins such as PTFE, Cyanate, Styrene Maleic Anhydride, etc. to improve high frequency performance.

Filler selection: 

Choose suitable inorganic fillers, such as talc, kaolin, etc., to improve the physical properties of the sheet and affect the dielectric constant.

Glass Fiber Cloth Selection: 

Select low dielectric constant glass fiber cloth, such as aramid fiber, polyether ether ketone (PEEK) fiber, etc., in order to reduce the dielectric constant of the plate.

Copper foil Treatment: 

The surface roughness of the copper foil affects the material properties, so proper treatment of the copper foil is required to optimize the current transfer.

Special Process Technology: 

e.g. plasma treatment (PLSMA) is used to treat the slag in the holes of PTFE materials and to improve the quality of the hole wall.

Drilling Processes: 

Drilling with UC drills (Under cut drill) for better hole wall quality.

Copper Immersion and Plating Process: 

specific chemical treatments are used before copper immersion, and plating parameters are controlled to ensure uniformity and adhesion.

Pattern Transfer and Etching Processes: 

Accurate pattern transfer and etching processes are critical to the performance of HF PCBs.

Impedance Control: 

Impedance control is a key technical parameter in the design and manufacture of HF PCBs and needs to be precisely controlled to meet circuit design requirements.

Environmental Control: 

The use of clean rooms ensures the cleanliness of the production environment and avoids the impact of contamination on PCB performance.

Quality Testing: 

In addition to flying probe testing, more detailed electrical performance testing, thermal performance testing, etc. may be included.

Post-processing: 

Such as OSP (Organic Protective Sheet) treatment, tin spraying, gold immersion, etc. to improve the soldering performance and long-term reliability of the PCB.

Packaging and Storage: 

Proper packaging and storage conditions are also important to ensure the performance of PCBs.

Customization: 

Customized adjustment and optimization according to the special needs of customers.

These steps and considerations reflect the complexity and high demand for accuracy in HF PCB manufacturing and ensure that the final product meets the performance standards required in HF applications.

We supply Rogers different series of boards all year round and have more than ten years of production experience. We mainly produce RF circuit boards, F4B circuit boards, high frequency, high speed and high difficulty circuit boards. If you need, please feel free to enquire!