Explain in detail the difference between RO3003 and RO4003?

RO3003 and RO4003 are both high-frequency circuit board materials produced by Rogers Corporation. They are both PTFE (polytetrafluoroethylene)-based composite materials and are commonly used in high-performance radio frequency and microwave circuit boards. Although they share a common PTFE base, they have some differences in properties and applications:

RO3003® Laminate Features:

Low Dielectric Loss Tangent: 

0.0010 @10Hz, which indicates that the material has very low loss at low frequencies.

Dielectric Constant: 

3.00, which is lower than the RO4003 series and suitable for applications requiring a lower dielectric constant.

Thermal Eexpansion Coefficient: 

X-axis is 17, Y-axis is 16, and Z-axis is 25. These values indicate the thermal expansion characteristics of the material in different axial directions.

Applications: 

Suitable for automotive radar, defense applications, and cost-sensitive aerospace applications.

RO4003C™ Laminates Features:

Dielectric constant: 

Usually higher than RO3003, the specific value needs to be checked in the specific specifications, but it is usually between 3.36 and 3.48.

Loss Tangent: 

Also usually low, which helps reduce losses in signal transmission.

Coefficient of Thermal Expansion: 

Lower compared to RO3003, which helps maintain the dimensional stability of the board as temperatures change.

Application: 

Suitable for applications requiring high dielectric constant and good thermal stability, such as high-performance RF amplifiers, filters and antenna arrays.

The difference:

Dielectric constant (Dk): 

RO3003 generally has a lower dielectric constant, while RO4003 offers the option of a higher dielectric constant, which affects the signal transmission speed and characteristic impedance of the circuit.

Dissipation tangent (Df): 

Both have very low dissipation tangent, but the specific values may be different, affecting the signal transmission loss in the material.

Coefficient of Thermal Expansion: 

RO4003 may have a lower coefficient of thermal expansion, which helps maintain board performance at different temperatures.

Cost: 

RO3003 may be more suitable for cost-sensitive applications due to its lower dielectric constant and cost-effectiveness.

Applications: 

RO3003 is suitable for automotive radar and some defense applications, while RO4003 may be more suitable for high-performance RF and microwave applications.

Frequency Range: 

Both RO3003 and RO4003 are designed for high frequency applications, however they may behave differently in different frequency ranges. RO3003 may be more suitable for low to medium frequency applications, while RO4003 may provide better performance at higher frequencies.

Mechanical Properties: 

Mechanical properties, such as tensile, flexural and compressive strength, may differ between the two materials. These properties are critical to ensure PCB reliability under mechanical stress.

Temperature Resistance: 

Although both have good temperature resistance, they may exhibit different electrical and physical properties at different temperatures.

Processability: 

Different materials may have an impact on the PCB manufacturing process. RO3003 and RO4003 may have different processing requirements during manufacturing steps such as drilling, lamination, etching, etc.

Thickness Consistency: 

Material thickness consistency is critical to ensure impedance control of the PCB. RO3003 and RO4003 may have different specifications in thickness tolerance.

Surface Properties: 

The surface roughness of the material and copper foil adhesion are very important for soldering and long-term reliability of the circuit board.

Environmental Stability: 

The stability of materials under different environmental conditions, such as humidity, temperature cycles, and ultraviolet irradiation, may affect the service life of the product in specific applications.

Flame Retardant Grade: 

Depending on the application needs, PCB materials may need to meet specific flame retardant grade requirements, which may affect the selection of RO3003 or RO4003.

Cost-benefit Analysis: 

While RO3003 may be more cost-effective in some applications, in applications requiring higher performance, RO4003 may be a more suitable choice, even if it costs more.

Supply Chain and Availability: 

Certain materials may be more readily available or have shorter lead times, which may impact project schedule and cost.

Design Simulation: 

When performing high-frequency PCB design, simulation software may have different models and parameters for different materials, which may affect design choices.

Technical Support and Data: 

Technical support and detailed product data from the manufacturer are critical to the proper selection and use of these materials.

When choosing RO3003 or RO4003, designers should consider all the above factors and make decisions based on specific design requirements and application scenarios. Typically, specific specifications and performance data for these materials can be found in the technical documentation provided by the manufacturer.

Our company has Rogers high frequency boards, RO3000, series, RO4000 series, RO5000 series, etc. all year round. If you have any needs for PCB high frequency boards, RF PCB and other circuit boards, please come to us for customized drawings. Welcome to inquire!