Differences Between High Frequency PCBs and Ordinary PCBs

Raw Materials: High frequency PCB mainly use high frequency high-speed copper-clad laminates, whose core requirement is to have a low dielectric constant (Dk) and a low dielectric loss factor (Df). In addition, high frequency and high-speed copper cladding board impedance characteristics and other physical characteristics are also very important. While the ordinary PCB use of copper cladding board does not have these special requirements.

Performance: High frequency PCB is mainly used for high frequency signal transmission, radio frequency (RF) circuits, microwave communications and other fields, so it needs to have a lower dielectric constant, lower loss factor and higher signal transmission speed. Ordinary PCB is mainly to meet the needs of general electronic products.

Manufacturing Process: High frequency PCB manufacturing process needs to be more precise and complex to ensure that the size, shape, location and other parameters of the circuit board accuracy, as well as to ensure that the lower Dk and Df. ordinary PCB manufacturing process is relatively simple, mainly to meet the needs of general electronic products.

Application Areas: High frequency PCBs are widely used in communication equipment, navigation and positioning systems, weapons systems and other fields. Ordinary PCBs are widely used in various electronic products.

Design Complexity: The design complexity of high frequency PCBs is higher than that of ordinary PCBs. in high frequency circuits, the signal frequency is very high, and the signal transmission speed is very fast, so it is necessary to accurately control the timing and waveform of the signal. In addition, high frequency circuits also need to consider signal interference, signal integrity and other issues, so the design process needs to consider more factors.

Number of Layers: High frequency PCBs usually have more layers to achieve more complex signal transmission and more efficient circuit layout. Ordinary PCBs, on the other hand, usually have fewer layers to meet the needs of general electronic products.

Surface Treatment:  The surface treatment of high frequency PCBs is usually gold-plated, chemically immersed in gold and other processes to reduce the impedance and loss in the signal transmission process. While ordinary PCBs are usually tin-plated, nickel-plated and other processes to meet the needs of general electronic products.

Cost:  Since high frequency PCBs require higher raw material costs, more complex manufacturing processes and higher design complexity, their costs are usually higher than ordinary PCBs.

There are some other differences between HF PCBs and regular PCBs:

Signal Integrity (SI):  High frequency PCBs need to consider signal integrity issues, including signal reflection, crosstalk, noise, etc.. In order to improve signal integrity, high frequency PCBs usually use some special design techniques, such as the use of impedance control, signal shielding, routing strategies. While ordinary PCB is mainly concerned about the signal transmission speed and stability, the requirements for signal integrity is relatively low.

Power Integrity (PI): High frequency PCBs need to consider the integrity of the power supply, including power supply noise, stability and efficiency. In order to improve power integrity, high frequency PCB usually use some special power design techniques, such as the use of decoupling capacitors, power plane, distributed power supply. While ordinary PCB is mainly concerned about the stability and reliability of the power supply, for power integrity requirements are relatively low.

Electromagnetic Compatibility (EMC):  High frequency PCBs need to consider electromagnetic compatibility issues, including electromagnetic interference, electromagnetic radiation and so on. In order to meet the requirements of electromagnetic compatibility, high frequency PCB usually use some special electromagnetic compatibility design techniques, such as the use of filters, isolation transformers, grounding technology. While ordinary PCB is mainly concerned about the functionality and stability of the product, the requirements for electromagnetic compatibility is relatively low.

Reliability: High frequency PCB due to its high-speed signal transmission and high frequency signal processing characteristics, the reliability of the circuit board requires high. Therefore, high frequency PCB usually use some special reliability design techniques, such as the use of high-reliability materials, fine processing technology, strict quality control. While ordinary PCB is mainly concerned about the durability and stability of the product, the reliability requirements are relatively low.

Therefore, high frequency PCB and ordinary PCB in the design complexity, number of layers, surface treatment, cost and other differences, but also need to consider the signal integrity, power integrity, electromagnetic compatibility and reliability issues. These differences make high frequency PCBs and ordinary PCBs have different characteristics and technical requirements in the design and manufacturing process.