Commonly Used Terms in PCB Circuit Boards
|Gold Fingers: Exposed metal pads on the side of the board, generally used as a connection between two circuit boards, such as memory sticks, old game cards.
|Hard Gold: Electroplated alloy.
|Soft Gold: Electroplated pure gold.
|Hole Ring: PCB metallization holes on the copper ring.
|Through-Hole: Through the entire circuit board, can be used to achieve internal interconnections or as a component of the mounting and positioning holes, lower cost, easy to realize.
|Blind Holes: Located in the top and bottom surface of the printed circuit board, connecting the surface layer of the line below the inner layer of the line, there is a certain depth, the depth of the hole is usually no more than a certain ratio (hole diameter).
|Buried Holes: Printed circuit board connection holes in the inner layer, it does not extend to the surface of the board.
|Stamp Holes: Split-board design method, with some continuous holes to form a weak connection point, the board from the collage to split out.
|Solder Pads: PCB surface of the exposed part of the metal, used to solder devices.
|Solder Resist: Copper covered with a protective film to prevent short circuits, corrosion and other problems.
|The Board: A large circuit board composed of many small circuit boards can be divided. Automated circuit board production equipment in the production of small boards often have problems, the combination of several small boards together, you can speed up production.
|Stencil: A thin metal template (can also be plastic), in the assembly, will be placed on the PCB so that the solder through some specific parts.
|Pick-and-place: Components to the circuit board on the machine or process.
|Silkscreen: Group soldering layer on the white is silkscreen layer.
|Solder Paste Layer: Before placing components on the PCB, will be through the stencil in the surface paste device pads formed on a certain thickness of the solder paste layer. In the reflow soldering process, the solder paste melts, in the pad and device pins between the establishment of reliable electrical and mechanical connections.
Solder Paste Layer
|Soldering Furnace: The furnace for soldering plug-ins. Generally there is a small amount of molten solder inside, the board card on the top of the rapid passage, you can expose the pins on the tin welded.
|Solder Mask: In order to prevent short circuits, corrosion and other problems, copper will be covered with a protective film. Protective film is generally green, may be other colors (Spark Fun red, Arduino blue, or Apple black). Generally known as "solde rmask".
|Linked Tin: Two connected pins on the device, by a small drop of solder incorrectly connected to each other.
|Surface Mount: A method of assembly, the device simply placed on the board, do not need to device pins through the board on the hole.
|Hot Pads: Refers to the connection pads to the plane between a short section of the alignment. If the pads do not do the proper thermal design, soldering is difficult to heat the pads to a sufficient soldering temperature. Improper heat dissipation pad design, the pad will feel more-sticky, and reflow time is relatively long. (translator's note, generally hot pads are made on the side of the insert that contacts the wave solder. I do not know why this article will mention reflow, reflow is mainly to consider the thermal balance, to prevent the monument.)
|V-score: The board will be an incomplete cut, you can break the board through this straight line. (translator's note: often called "V-CUT").
|Through-hole: A hole in the card, generally used to switch the signal from one layer to another.
|Plug Holes: Refers to the over-hole covered with solder-mask to prevent being soldered. Connector or device pin holes, because of the need to solder, generally not plug holes.
|The Panel: A large circuit board composed of many small circuit boards can be divided.
|Slotting: PCB on any hole that is not round, can be plated or not plated.
|Wave Soldering: Molten solder to form a wave of solder to the components of the welding, applicable to chip electronic components.
|Reflow Soldering: High-temperature hot air to form a reflow of molten solder on the components to be soldered, applicable to the pin electronic components.
|Lead Spacing: The center distance between adjacent leads.
|DRC: Design Rule Check.
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