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PCBA Process Common to The Quality of The Process Problems

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In the PCBA process, common quality problems include:

Poor Soldering: Including false soldering, cold soldering, continuous soldering and other problems, which may be caused by insufficient amount of solder paste, insufficient soldering temperature or short soldering time.

Component Damage: Due to improper operation or equipment failure and other reasons, may lead to component pin breakage, chip damage and other problems.

Circuit Board Short Circuit: May be due to the soldering point distance is too close, the parts are arranged in the wrong design, the solder direction is not correct, and so on.

Empty Soldering: It may be caused by unclean soldering riffles, high foot warping, poor solderability of parts, etc.

Standing Parts: May be caused by improper product design resulting in uneven heating of the ends of the components, mounting level offset and other reasons.

Non-standardized Solder Joints: The shape, size and position of the solder joints do not meet the requirements, which may lead to problems such as poor connection or unstable electrical performance.

Component Polarity Error: Due to operational errors or design errors, etc., may lead to component polarity reversal or wrong connection, resulting in the circuit can not work properly.

Circuit Board Wiring Errors: Wiring irregularities, signal line misconnections or missed connections and other problems may affect the performance and stability of the circuit.

Electrostatic Interference: Due to improper operation or equipment not grounded, etc., may lead to electrostatic interference, affecting the normal operation of the circuit.

Component Pin Oxidation: Component pins exposed to air for a long time may be oxidized and lose conductivity, resulting in the circuit not working properly.


In addition to the quality problems mentioned above, the following problems may also exist in the PCBA process:

Tin Beads and Slag:  During the soldering process, ifthere is too much solder or the soldering temperature is too high, it may lead to problems such as tin beads and slag. These residues may lead to short circuits or affect the appearance of the circuit.

Component Offset: Mounter in the placement of components, if the parameters are not set properly or machine failure, may lead to component position offset, affecting the welding effect and circuit performance.

PCB Warpage:  PCB boards may warp during the process due to uneven heat or mechanical stress, affecting soldering quality and circuit performance.

Gold Finger Oxidation:  If the gold finger on the PCB board is exposed to air for a long time, it may be oxidized and affect the conductivity, resulting in the circuit can not work properly.

Cleaning Problems: Cleaning problems in the process may also lead to quality problems, such as flux residue, dust contamination, etc. may affect the performance and stability of the circuit.

All of the above problems need to be strictly controlled in the production process, take appropriate measures to prevent and correct, in order to ensure that the quality and performance of PCBA meet the requirements.

In order to reduce the occurrence of these problems, a series of quality control measures can be taken, such as strengthening employee training, regular inspection of equipment and tools, optimizing process parameters, and establishing a sound material management system. At the same time, automated equipment and intelligent technology can also be introduced to improve production efficiency and process control capabilities to further enhance the quality and reliability of PCBA.

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