PCBA Making Process-PCB Process and Technology

Printed circuit board process and technology can be divided into single-sided, double-sided and multilayer printed circuit board. Now take double-sided board and the most complex multilayer board as an example.

A. Conventional Ddouble-sided Board Process and Technology.

1. a, Open material - drilling - hole and full-board plating - graphic transfer (film, exposure, development) - etching and decoupling – solder mask and word elements - HAL or OSP, etc. - Contouring - Inspection - Finished product.
2. b, Cutting-Drilling- Perforation - Pattern transfer - Plating - Deprocessing and etching - Resist (Sn, or Sn/pb) -Plating plugs – Solder mask and characters - HAL or OSP, etc. - Contouring - Inspection - Finished Product.

B. Conventional Multilayer Processes and Technologies.

Cutting - Inner layer fabrication - Oxidizing - Laminating - Drilling - Hole plating (full board and graphic plating) - Outer layer fabrication - Surface coating -Surface CoatingShape processing - Inspection - Finished product.

(Note 1): Inner layer fabrication is defined as in-process board making after material opening - Graphic transfer (film forming, exposure, development) - Etching and decoating - Inspection, etc.

Etching and decoating - Inspection, etc. (Note 2): Outer layer production refers to the process of making the board after opening.

(Note 2): Outer layer fabrication refers to the process of making boards after hole plating - graphic transfer (filming, exposure, development).

- Etching and decoating, etc.

(Note 3): Surface coating refers to the process of coating (plating) (e.g., HAL, OSP, chemical Ni/Au, chemical Ag, chemical Sn, etc.) after the outer layer has been fabricated - soldermask and characters.

C. Buried/Blind Hole Multilayer Processes and Techniques.

Sequential lamination method is generally used. Namely: Cutting- Formation of core board (equivalent to conventional double-sided board or multilayer board) - Laminating - The following process is the same as conventional multilayer board.

(Note 1): Formation of core boards means that after double-sided boards or multilayers created by conventional methods, buried/blind holes multilayers are formed according to the structural requirements. If the thickness to diameter ratio of the holes in the core board is large, the holes should be plugged in order to ensure its reliability.

D. Accumulated Multilayers Process Flow and Technology.

Core Board Fabrication - Laminating RCC - Laser Drilling - Perforation Plating - Pattern Transfer - Etching & Decoating- Laminating RCC - Iterative process to form a n b structure of integrated printed circuit boards (HDI/BUM boards).

(Note 1): Core boards in this context refer to a wide variety of boards such as conventional double-sided, multilayer boards, buried/blind vias multilayer boards, etc. However, these core boards must be plugged. However, these core boards must be plugged and surface smoothed before they can be laminated.

(Note 2): The structure of HDI/BUM multilayer boards can be expressed by the following formula.

a n b

a- is the number of layers in one side of the laminate, n- is the core board, and b- is the number of layers in the other side of the laminate.

E. Integrated Component Multilayer Processes and Technologies.

Opening - Inner layer production - Flat component production - The following process is the same as multilayer board production.

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