PCB to PCBA Order Process
A. From the Initial Definition of the Product - the Overall Program Stage:
Estimated set standards, set goals:Project functions Time schedule Quality requirements Cost requirements Interface requirements Appearance requirements Production requirements Project definition Overall cost comparison.
Baseband (ESD):Functionality and the use of platform resources to assess the feasibility of completing the selection of devices, assess the price of new devices and delivery cycle.
ESD performance and grounding method evaluation.
Audio:According to the project definition, complete the selection of amplifiers, speakers, earpieces and mic. Evaluate whether the structure meets our requirements, in order to clarify whether the hand-version debugging results can meet the sound quality requirements of our sealed prototype.
Antenna:Evaluate the antenna according to the MD and consider some limit cases.
RF:RF device selection and evaluation of new devices.
Layout:Preliminary evaluation of the layout to see if it is reasonable, and consider the bezel-less design of the layout to reduce the cost. Evaluate whether the fixture can be generalized.
Hardware Project Leader:Define the product definition with the project team, such as: Product positioning, platform, flash size, LCD size, support functions, etc. A project definition document should be given to the software team to facilitate the project management and the arrangement of standard prototypes.
Synthesize the opinions of each functional block and feedback to improve.
B. Hardware Schematic Stage:
Baseband (ESD):Determine the schematic. Confirmation of peripheral device specifications and new function schematic confirmation.
Give IO mapping documents to the driver
Confirm whether there is reserved ESD protection devices.
Audio, Antenna, RF:Finalize and confirm the schematic.
Layout: further evaluate the layout
Hardware project leader:Confirm the test point reservation with production and evaluate the test method.
Improve the project definition document, make it clear what functions are compatible and what functions can not be realized, and update the document to the relevant personnel.
C. The First Layout Stage:
Baseband (ESD), audio, antenna, RF, antenna:Alignment evaluation.
Layout:Alignment arrangement and release. Whether the collocation is economical.
Hardware project leader:Production test feedback.
D. PCB Board Sampling Stage:
Baseband (ESD), audio, antenna, RF, antenna:New features demo board debugging
Layout:Engineering problem response.
Hardware project leader:Trial production BOM preparation, trial production schedule. Gap material preparation.
Preliminary cost accounting.
Peripheral material sampling arrangements:Shielding frame, LCD, camera, structure of the hand version, battery, speaker samples.
Key dome, etc., these arrangements for the device as far as possible according to the project definition of the specified sampling, hand version to the rear loading machine can be used as a standard prototype.
Production Software Arrangement.
Screen printing board, patch jig arrangement.
E. The First Test Phase:
Baseband (ESD):To determine the implementation of the various functions of the software. ESD assessment, give recommendations for modification, and out of an ESD standard processing documents;
Evaluation of power consumption and optimization of the whole machine;
Audio:Debugging of audio burst. Speaker, earpiece, mic effect debugging, whether it can meet the prototype standard, give suggestions for modification, and give an audio design guidance document. And give a preliminary audio parameters;
Antenna:Debug the antenna, and evaluate the limit cases, give an antenna design guidance (need to give a preliminary result).
RF: Test of relevant functions;
Layout:Trial production SMT problem improvement;
Hardware Project Leader:Hardware test results summary table, solution measures summary table. Antenna, ESD, audio performance improvement program;
After-sales PCB board evaluation;
Arrange to send customer samples, and collect customer feedback, arrange project upgrade;
Production software update and RF calibration documentation;
Provision of software standard prototypes;
Give the motherboard instruction manual.
F. Second PCB Board and Manufacturer Sampling Stage:
Baseband (ESD), audio, antenna, layout;
Hardware project leader:To provide a more accurate BOM, gap material preparation;
Screen printing board and patch fixture, download fixture, visual fixture preparation;
Arrange and track the software qualification;
Modified BOM and cost accounting.
G. Second Test Phase:
Baseband (ESD):Determine the implementation of the various functions of the software. confirmation of the effect of ESD modifications and update of the ESD standard processing documentation.
Evaluate the power consumption of the whole machine;
Audio:Debugging of audio burst. Confirm the effect of modification on speakers, earpiece and mic, and update the audio design guideline document.
Confirm the default audio parameters;
Antenna:Debug the antenna and evaluate the limit cases, confirm the effect of modification, and update the antenna design guideline (need to give a preliminary result);
RF:Testing of relevant functions. Provide default RF parameters;
Layout:Trial production SMT problems to improve the effect of confirmation;
Hardware project leader:Hardware test results summary table, solution measures summary table. Antenna, ESD, audio performance improvement program effect confirmation;
Modified BOM and costing;
Arranging to send customer samples;
Production fixture verification, then arrange to duplicate the fixture;
Upgrade the motherboard manual.
H. Small Batch Production (Customer BOM):
Determination of production fixtures;
Various customer fault tracking feedback.
I. Mass Production:
Production tracking. Mass production material tracking, and after-sales tracking;
Workshop mass production software release and customer software release;
Customer prototype confirmation.
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