Multilayer Circuit Board Manufacturers
Minimum Line Width : 3MIL ;
Minimum Line Spacing : 3MIL ;
Drilling Diameter : ≥ 0.1mm ;
Surface Technology : Gold deposition, Gold plating, Tin spraying, OSP ;
Processing Size : 600 * 1200mm ;
Plate Thickness : 0.1-10mm ;
Processing Layers : 2-36 layers.
The company is equipped with cutting equipment, printing equipment, bonding equipment, etching equipment, and testing equipment.
The company has domestic and imported high-frequency plates all year round, including Rogers, Taconic, Isola, F4B, TP-2, FR4, etc., with complete models.
A double-sided board is a center layer of media with alignment layers on both sides. A multilayer board is multiple alignment layers with a dielectric layer between each two layers, and the dielectric layer can be made very thin. Multilayer boards have at least three conductive layers, two of which are on the outer surface, while the remaining layer is synthesized within an insulating board. Electrical connections between them are usually made through plated-through holes in the cross-section of the board.
Circuit board according to the number of wiring surface to determine the difficulty of the process and processing prices, ordinary circuit boards are divided into single-sided alignment and double-sided alignment, commonly known as single-sided and double-sided panels, but high-end electronic products, due to the constraints of the product space design factors, in addition to the surface wiring, the internal can be stacked multi-layer line, the production process, the production of each layer of the line, and then through the positioning of the optical equipment, press-fit, so that the multilayer line is stacked in a piece of Circuit board. Commonly known as multilayer circuit boards. Any circuit board greater than or equal to 2 layers, can be called multilayer circuit board. Multilayer circuit boards can be divided into, multilayer rigid circuit boards, multilayer hard and soft circuit boards, multilayer hard and soft combination of circuit boards.
Multilayer circuit boards have at least three conductive layers, two of which are on the outer surface, while the remaining layer is synthesized within an insulating board. Electrical connections between them are usually realized through plated-through holes in the cross-section of the circuit board. Unless otherwise stated, multilayer printed circuit boards, like double-sided boards, are generally plated through-hole boards.
Multi-substrate boards are manufactured by stacking two or more layers of circuits on top of each other with reliable pre-determined interconnections between them. Since the drilling and plating is done before all the layers are milled together, this technique violates the traditional fabrication process from the start. Unlike the innermost two layers, which consist of conventional double-sided panels, the outer layers are made up of separate single-sided panels. Prior to lamination, the inner substrate is drilled, through-hole plated, graphics transferred, developed, and etched. The outer layer that is drilled is the signal layer, which is plated through by forming a balanced ring of copper around the inner edge of the via hole. The layers are then laminated together to form a multisubstrate, which can be interconnected (component-to-component) using wave soldering.