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5G Base Station PCB

Wireless Base Station High Frequency Circuit Board

Minimum Line Width : 3MIL ;

Minimum Line Spacing : 3MIL ;

Drilling Diameter : ≥ 0.1mm ;

Processing Size : 600 * 1200mm; 

Plate Thickness : 0.1-10mm ;

Processing Layers : 2-36 layers;

Special Process : Thick gold plate, ultra thick plate, depth control drilling, back drilling, hole filling electroplating, copper slurry plug hole, mechanical blind hole, etc.

Surface Treatment Processes : Include OSP, gold precipitation, silver precipitation, tin precipitation, gold plating, pure gold plating, thick gold plating, nickel palladium gold plating, nickel plating, tin plating, tin spraying, etc.


5G Base Station High Frequency Circuit Board Surface Treatment Process

Together to understand the 5G base station high frequency circuit board in the surface treatment process should be how to choose. In front of a bare copper board and a high-frequency circuit board with a surface treatment process, we will choose to do the surface treatment of the high-frequency circuit board. The reason is very simple, although the bare copper board in the performance of the above is very good, but in order to ensure good solderability and electrical properties of the purpose, then choose the surface treatment process is the most basic step.

High-frequency circuit board copper surface in the air for a long time to maintain the original copper is impossible, copper once exposed to moisture in the air will appear in a short period of time oxidation phenomenon. So we must give the copper wrapped in a layer of solder resist out of copper oxides, but the industry generally will not use this solder resist that in addition to the form, will use the present chemical nickel / immersion gold (ENIG), immersion silver, immersion tin, etc. these surface treatment processes

Dip silver process: dip silver is between the OSP and dip gold between the two. It is a relatively simple and fast process to do, silver-impregnated high-frequency circuit boards even if exposed to moisture, heat and pollution of the environment, it is still able to maintain good solderability.

Immersion tin process: Immersion tin process is very promising, because the solder is based on tin, so tin can be matched with any solder. The high solderability of tin can be seen here, and the tin process also has good thermal stability after technological upgrading.

Nickel-plated / immersion gold process: equivalent to the 5G base station high frequency circuit board cloaked in thick armor, so that the high-frequency circuit board can be used for a long period of time in the process can also maintain good conductive function; In addition, nickel-plated / immersion gold with other processes do not have fear of prepared for the environment has a strong endurance, for example: the touch screen switches and plugs these above the best choice of nickel-plated / immersion gold process, because of gold fingers in the welding, conductivity, resistance to friction and life of the soldering. Conductivity, friction resistance and life are better.

Process Capability Parameters

Sequence  Number ProjectParameters
1Materials Rogers, Taconic, Arlon, Isola, Wangling, Zhongying, Panasonic, Shengyi, etc
2Maximum Layer sample 36L/Batch 28L
3Maximum Plate ThicknessSamples 8.0mm/Batch 6.0mm
4Thinnest Plate Thickness2L-0.1mm
5Maximum Panel Size1200 * 610mm
6Minimum Line Width Line Spacing0.075mm (3mil)
7Minimum Pad Spacing0.1mm (4mil)
8Completed Aperture0.15mm-6.3mm
9Hole Wall Copper Thickness> 25um (1mil)
10Appearance Tolerance ± 0.1mm (4mil)
11Impedance Tolerance± 10%
12PTH Aperture Tolerance± 0.075mm (3mil)
13NPTH Hole Tolerance± 0.05mm (2mil)
14Hole Position Deviation± 0.05mm (2mil)
15Minimum Blind Buried Hole0.1mm (4mil)
16Plate Bending and Warping ≤ 0.7%
17Outer Copper Thickness 1oz-5oz
18Lnner Layer Copper Thickness1/2oz-4oz
19Outer Copper Thickness 12:01
20SMT Minimum Green Oil Width0.08mm
21Minimum Green Oil Window Opening0.05mm
22Special ProcessThick gold plate, Ultra thick plate, Depth control drilling, Back drilling, Hole filling electroplating, Copper slurry plug hole, Mmechanical blind hole, etc.
23Surface Treatment ProcessesInclude OSP, Gold precipitation, Silver precipitation, Tin precipitation, Gold plating, Pure gold plating, Thick gold plating, Nickel palladium gold plating, Nickel plating, Tin plating, Tin spraying, etc.


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