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4 Layers PCB

4 Layers High Frequency PCB

Substrate / Thickness : FR-4/1.2mm

Size : 140mm*159mm

Minimum Line Width/Spacing : 6mil/6mil

Minimum Hole Diameter : 0.4mm

Surface Treatment : Gold plating

Category : Computer; Four Layers

Substrate / Thickness : FR-4/1.6mm

Size : 294mm*200mm

Minimum Line Width/Spacing : 5mil/5mil

Minimum Hole Diameter : 0.3mm

Surface Finish : Tin Spray (Hot Air Leveling)


PCB multilayer board is used for electrical products in the multilayer circuit boards, multilayer board with more single-sided or double-sided wiring board. With a double-sided for the inner layer, two single-sided for the outer layer or two double-sided for the inner layer, two single-sided for the outer layer of the printed circuit board, through the positioning system and insulating bonding material alternating together and conductive graphics according to the design requirements for interconnecting printed circuit boards have become four-layer, six-layer printed circuit boards, also known as multilayer printed circuit boards.

With the continuous development of SMT (surface mount technology), as well as a new generation of SMD (surface mounted devices) continue to launch, such as QFP, QFN, CSP, BGA (especially MBGA), so that the electronic products are more intelligent, miniaturization, and thus promote a major reform and progress of the PCB industry technology. Since 1991, IBM first successfully developed a high-density multilayer board (SLC) since the countries of the major groups have developed a variety of high-density interconnect (HDI) microvia board. The rapid development of these processing technologies, prompted by the design of the PCB has been gradually to the multilayer, high-density wiring direction. Multilayer printed circuit board with its flexible design, stable and reliable electrical performance and superior economic performance, is now widely used in the manufacture of electronic products.

Future Ttrends in The Development of Multilayer Board:

a, High density;

b, Thin multilayer (high) layerization;

c, Diversification of multilayer board structure;

d, High-performance thin copper box of thin substrates;

e, High surface flatness and surface coating technology;

f, Flexible multilayers and rigid-flexible multilayers.


PCB Multilayer Characteristics:

The biggest difference between PCB multilayer boards and single-sided and double-sided boards is the addition of an internal power supply layer (to maintain the internal power layer) and grounding layer, the power supply and ground network is mainly wired on the power supply layer. However, multilayer board wiring is still mainly top and bottom layers, supplemented by the middle wiring layer. Therefore, the design of multilayer boards is basically the same as the design method of double-sided boards, and the key lies in how to optimize the wiring of the internal electrical layer, so that the circuit board wiring is more reasonable and better electromagnetic compatibility.


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